Via Covering

Via Covering Options

Via covering determines how plated through-hole vias are treated on the finished PCB.

Tented

Vias are covered with solder mask on both sides. The vias are not processed with HASL or ENIG finish. This is the most common and cost-effective option, providing basic protection against solder bridging.

Untented

Vias are left open (exposed copper), processed the same as all other exposed copper pads. The via annular ring will receive the selected surface finish.

Plugged

Vias are filled with solder resist material. Coverage is ≥70% of the via hole. This option helps prevent solder from flowing through vias during assembly, which is important for vias located under BGA pads.

Epoxy Filled & Capped

Vias are filled with epoxy or copper paste and then capped (plated over). Coverage is ≥95%, providing a flat, solderable surface. This is the premium option for via-in-pad designs requiring maximum reliability.