Edge Plating

Edge Plating

Edge plating (also called plated edges or edge metallization) is the process of plating copper along the edges of a PCB. It enhances durability, improves EMC performance, and provides better grounding.

Benefits

• EMI Shielding: Reduces electromagnetic interference by creating a continuous ground plane along the board edge
• Signal Integrity: Improves signal integrity in high-frequency designs
• Mechanical Protection: Protects board edges from physical damage
• Grounding: Provides additional grounding paths between layers

Specifications

• Edge plating thickness: 25µm minimum
• Compatible with HASL and ENIG surface finishes
• Board thickness must be ≥0.8mm